Journals in DBLP

Microelectronics Reliability
2005, volume: 45, number: 12

1. Rolf-Peter Vollertsen, Enrique Miranda
   The TDDB power-law model - Physics and experimental evidences. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2005, v:45, n:12, pp:1807-1808 [Journal]
   
2. Ernest Y. Wu, Jordi Suñé
   Power-law voltage acceleration: A key element for ultra-thin gate oxide reliability. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2005, v:45, n:12, pp:1809-1834 [Journal]
   
3. Thomas Pompl, Michael Röhner
   Voltage acceleration of time-dependent breakdown of ultra-thin gate dielectrics. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2005, v:45, n:12, pp:1835-1841 [Journal]
   
4. G. Ribes, S. Bruyère, M. Denais, F. Monsieur, V. Huard, D. Roy, G. Ghibaudo
   Multi-vibrational hydrogen release: Physical origin of T_bd, Q_bd power-law voltage dependence of oxide breakdown in ultra-thin gate oxides. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2005, v:45, n:12, pp:1842-1854 [Journal]
   
5. A. Haggag, N. Liu, D. Menke, M. Moosa
   Physical model for the power-law voltage and current acceleration of TDDB. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2005, v:45, n:12, pp:1855-1860 [Journal]
   
6. Rainer Duschl, Rolf-Peter Vollertsen
   Is the power-law model applicable beyond the direct tunneling regime? [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2005, v:45, n:12, pp:1861-1867 [Journal]
   
7. Peter Ersland, Roberto Menozzi
   Editorial. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2005, v:45, n:12, pp:1868- [Journal]
   
8. Yuan Chen, Qing Wang, Sammy Kayali
   A statistical approach to characterizing the reliability of systems utilizing HBT devices. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2005, v:45, n:12, pp:1869-1874 [Journal]
   
9. William J. Roesch, Dorothy June M. Hamada
   Metal defect yield and reliability relationships. [Citation Graph (0, 0)][DBLP]
   Microelectronics Reliability, 2005, v:45, n:12, pp:1875-1881 [Journal]
   
10. Charles S. Whitman, Michael Meeder
    Determining constant voltage lifetimes for silicon nitride capacitors in a GaAs IC process by a step stress method. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1882-1893 [Journal]
    
11. Takayuki Hisaka, Yasuki Aihara, Yoichi Nogami, Hajime Sasaki, Yasushi Uehara, Naohito Yoshida, Kazuo Hayashi
    Degradation mechanisms of GaAs PHEMTs in high humidity conditions. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1894-1900 [Journal]
    
12. Andrzej Dziedzic
    IMAPS Poland 2004 - Guest Editorial. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1901-1902 [Journal]
    
13. G. G. Umarji, S. A. Ketkar, G. J. Phatak, V. D. Giramkar, U. P. Mulik, D. P. Amalnerkar
    An aqueous developable photoimageable silver conductor composition for high density electronic packaging. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1903-1909 [Journal]
    
14. Zbigniew Suszynski, Radoslaw Duer
    Photoacoustic inspection of thermal properties of layered structure with pulse excitations. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1910-1915 [Journal]
    
15. Cho-Liang Chung, Liang-Tien Lu, Yao-Jung Lee
    Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package). [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1916-1923 [Journal]
    
16. Darko Belavic, Marko Hrovat, Jaroslaw Kita, Janez Holc, Jena Cilensek, Leszek J. Golonka, Andrzej Dziedzic
    Evaluation of compatibility of thick-film PTC thermistors and LTCC structures. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1924-1929 [Journal]
    
17. W. Zaraska, P. Thor, M. Lipinski, M. Ciez, W. Grzesiak, J. Poczatek, K. Zaraska
    Design and fabrication of neurostimulator implants - selected problems. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1930-1934 [Journal]
    
18. Ryszard Kisiel, Janusz Borecki, Grazyna Koziol, Jan Felba
    Conductive adhesives for through holes and blind vias metallization. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1935-1940 [Journal]
    
19. Marek Wronski, Slawomir Kaminski, Edward Mis, Andrzej Dziedzic
    New trim configurations for laser trimmed thick-film resistors - theoretical analysis, numerical simulation and experimental verification. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1941-1948 [Journal]
    
20. Mile K. Stojcev
    N.G. Jacobson, The In-System Configuration Handbook: A Designer's Guide to ISC, Kluwer Academic Publishers, Boston, 2004, ISBN 1-4020-7655-X. Hardcover, pp 201, plus XVII. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1949-1950 [Journal]
    
21. Mile K. Stojcev
    Gregory A. Matson, Tony R. Taylor, Julie N. Villar, Elements of STIL: Principles and Applications of IEEE Std. 1450, Kluwer Academic Publishers, Boston, 2003, Hardcover, pp 291, plus XIX, ISBN 1-4020-7637-1 [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2005, v:45, n:12, pp:1951-1952 [Journal]