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Journals in DBLP

Microelectronics Reliability
2002, volume: 42, number: 9-11

  1. Fausto Fantini, Massimo Vanzi
    Editorial. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1249- [Journal]
  2. H. Iwai, S. Ohmi
    Trend of CMOS downsizing and its reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1251-1258 [Journal]
  3. Michael G. Pecht, Diganta Das, Arun Ramakrishnan
    The IEEE standards on reliability program and reliability prediction methods for electronic equipment. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1259-1266 [Journal]
  4. Wolfgang Stadler, K. Esmark, Harald Gossner, M. Streibl, M. Wendel, Wolfgang Fichtner, Dionyz Pogany, Martin Litzenberger, E. Gornik
    Device Simulation and Backside Laser Interferometry--Powerful Tools for ESD Protection Development. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1267-1274 [Journal]
  5. F. Zängl, Harald Gossner, K. Esmark, R. Owen, G. Zimmermann
    Case study of a technology transfer causing ESD problems. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1275-1280 [Journal]
  6. M. Blaho, Dionyz Pogany, L. Zullino, A. Andreini, E. Gornik
    Experimental and simulation analysis of a BCD ESD protection element under the DC and TLP stress conditions. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1281-1286 [Journal]
  7. M. S. B. Sowariraj, Theo Smedes, Cora Salm, Ton J. Mouthaan, Fred G. Kuper
    The influence of technology variation on ggNMOSTs and SCRs against CDM BSD stress. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1287-1292 [Journal]
  8. Gaudenzio Meneghesso, A. Cocco, G. Mura, Simona Podda, Massimo Vanzi
    Backside Failure Analysis of GaAs ICs after ESD tests. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1293-1298 [Journal]
  9. P. Galy, V. Berland, B. Foucher, A. Guilhaume, J. P. Chante, S. Bardy, F. Blanc
    Experimental and 3D simulation correlation of a gg-nMOS transistor under high current pulse. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1299-1302 [Journal]
  10. L. Sponton, L. Cerati, G. Croce, G. Mura, Simona Podda, Massimo Vanzi, Gaudenzio Meneghesso, Enrico Zanoni
    ESD protection structures for 20 V and 40 V power supply suitable for BCD6 smart power technology. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1303-1306 [Journal]
  11. J. L. Goudard, P. Berthier, X. Boddaert, D. Laffitte, J. Périnet
    New qualification approach for optoelectronic components. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1307-1310 [Journal]
  12. M. Giglio, G. Martines, G. Mura, Simona Podda, Massimo Vanzi
    An automated lifetest equipment for optical emitters. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1311-1315 [Journal]
  13. Massimo Vanzi, G. Salmini, R. Pastorelli, S. Pessina, P. Furcas
    Reliability tests on WDM filters. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1317-1321 [Journal]
  14. François Caloz, Daniel Ernst, Patrick Rossini, Laura Gherardi, Lisa Grassi, Jean Arnaud
    Reliability of optical connectors - Humidity behavior of the adhesive. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1323-1328 [Journal]
  15. Klaus Duerr, Reinhard Pusch, Gottfried Schmitt
    Reliability Problems of Passive Optical Devices and Modules after Mechanical, Thermal and Humidity Testing. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1329-1332 [Journal]
  16. T. Tomasi, I. De Munari, V. Lista, L. Gherardi, A. Righetti, M. Villa
    Passive optical components: from degradation data to reliability assessment - preliminary results. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1333-1338 [Journal]
  17. L. Tielemans, R. Rongen, Ward De Ceuninck
    How reliable are reliability tests? [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1339-1345 [Journal]
  18. G. Scandurra, C. Ciofi, C. Pace, F. Speroni, F. Alagi
    True constant temperature MTF test system for the characterization of electromigration of thick Cu interconnection lines. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1347-1351 [Journal]
  19. B. Mongellaz, F. Marc, N. Milet-Lewis, Y. Danto
    Contribution to ageing simulation of complex analogue circuit using VHDL-AMS behavioural modelling language. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1353-1358 [Journal]
  20. R. Petersen, Ward De Ceuninck, Jan D'Haen, Marc D'Olieslaeger, Luc De Schepper, O. Vendier, H. Blanck, D. Pons
    Exploring the limits of Arrhenius-based life testing with heterojunction bipolar transistor technology. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1359-1363 [Journal]
  21. A. Mervic, A. Lanzani, M. Menchise, P. Serra, D. Gerosa
    Contact resistivity instability in embedded SRAM memory. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1365-1368 [Journal]
  22. E. Carvou, F. Le Bihan, A. C. Salaün, R. Rogel, Olivier Bonnaud, Yannick Rey-Tauriac, Xavier Gagnard, L. Roland
    Reliability improvement of high value doped polysilicon-based resistors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1369-1372 [Journal]
  23. M. Mugnaini, M. Catelani, G. Ceschini, A. Masi, F. Nocentini
    Pseudo Time-Variant parameters in centrifugal compressor availability studies by means of Markov models. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1373-1376 [Journal]
  24. G. Ceschini, M. Mugnaini, A. Masi
    A reliability study for a submarine compression application. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1377-1380 [Journal]
  25. M. Catelani, R. Nicoletti
    A Custom-designed automatic measurement system for acquisition and management of reliability data. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1381-1384 [Journal]
  26. Yong-Ha Song, Myoung-Lae Park, Gye-Won Jung, Taek-Soo Kim
    A study of advanced layout verification to prevent leakage current failure during power down mode operation. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1385-1388 [Journal]
  27. V. Lista, P. Garbossa, T. Tomasi, M. Borgarino, Fausto Fantini, L. Gherardi, A. Righetti, M. Villa
    Degradation Based Long-Term Reliability Assessment for Electronic Components in Submarine Applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1389-1392 [Journal]
  28. P. Battista, M. Catelani, G. Fasano, A. Materassi
    On the reliability of instruments for environmental monitoring: some practical considerations. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1393-1396 [Journal]
  29. D. M. Fleetwood
    Hydrogen-related reliability issues for advanced microelectronics. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1397-1403 [Journal]
  30. B. Cretu, F. Balestra, G. Ghibaudo, G. Guégan
    Origin of hot carrier degradation in advanced nMOSFET devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1405-1408 [Journal]
  31. E. Andries, R. Dreesen, K. Croes, Ward De Ceuninck, Luc De Schepper, Guido Groeseneken, K. F. Lo, Marc D'Olieslaeger, Jan D'Haen
    Statistical aspects of the degradation of LDD nMOSFETs. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1409-1413 [Journal]
  32. H. V. Nguyen, Cora Salm, J. Vroemen, J. Voets, B. Krabbenborg, J. Bisschop, A. J. Mouthaan, Fred G. Kuper
    Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1415-1420 [Journal]
  33. H. V. Nguyen, Cora Salm, R. Wenzel, A. J. Mouthaan, Fred G. Kuper
    Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1421-1425 [Journal]
  34. Ruggero Feruglio, Fernanda Irrera, Bruno Riccò
    Microscopic aspects of defect generation in SiO2. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1427-1432 [Journal]
  35. Mahesh S. Krishnan, Viktor Kol'dyaev, Eiji Morifoji, Koji Miyamoto, Tomasz Brozek, Xiaolei Li
    Series resistance degradation due to NBTI in PMOSFET. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1433-1438 [Journal]
  36. S. Gamerith, M. Pölzl
    Negative bias temperature stress on low voltage p-channel DMOS transistors and the role of nitrogen. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1439-1443 [Journal]
  37. R. Rodríguez, James H. Stathis, Barry P. Linder, S. Kowalczyk, C. T. Chuang, R. V. Joshi, G. Northrop, K. Bernstein, A. J. Bhavnagarwala, Salvatore Lombardo
    Analysis of the effect of the gate oxide breakdown on SRAM stability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1445-1448 [Journal]
  38. B. Domengès, P. Schwindenhammer, P. Poirier, Felix Beaudoin, Ph. Descamps
    Comprehensive failure analysis of leakage faults in bipolar transistors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1449-1452 [Journal]
  39. A. Muehlhoff
    Inversion of degradation direction of n-channel MOS-FETs in off-state operation. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1453-1456 [Journal]
  40. Hajdin Ceric, Siegfried Selberherr
    Simulative prediction of the resistance change due to electromigration induced void evolution. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1457-1460 [Journal]
  41. A. N. Nazarov, I. N. Osiyuk, V. S. Lysenko, T. Gebel, L. Rebohle, W. Skorupa
    Charge trapping and degradation in Ge+ ion implanted SiO2 layers during high-field electron injection. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1461-1464 [Journal]
  42. Ninoslav Stojadinovic, I. Manic, S. Djoric-Veljkovic, V. Davidovic, D. Dankovic, S. Golubovic, S. Dimitrijev
    Mechanisms of spontaneous recovery in positive gate bias stressed power VDMOSFETs. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1465-1468 [Journal]
  43. M. R. Carriero, S. Di Pascoli, Giuseppe Iannaccone
    Simulation of failure time distributions of metal lines under electromigration. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1469-1472 [Journal]
  44. G. Ghidini, D. Brazzelli
    Evaluation methodology of thin dielectrics for non-volatile memory application. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1473-1480 [Journal]
  45. Salvatore Lombardo, James H. Stathis, Barry P. Linder
    Dependence of Post-Breakdown Conduction on Gate Oxide Thickness. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1481-1484 [Journal]
  46. S. Aresu, Ward De Ceuninck, R. Dreesen, K. Croes, E. Andries, J. Manca, Luc De Schepper, Robin Degraeve, Ben Kaczer, Marc D'Olieslaeger
    High-resolution SILC measurements of thin SiO2 at ultra low voltages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1485-1489 [Journal]
  47. E. Viganò, A. Ghetti, G. Ghidini, A. S. Spinelli
    Post-breakdown characterization in thin gate oxides. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1491-1496 [Journal]
  48. D. Roy, S. Bruyère, E. Vincent, F. Monsieur
    Series resistance and oxide thickness spread influence on Weibull breakdown distribution: New experimental correction for reliability projection improvement. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1497-1500 [Journal]
  49. J. M. Rafí, B. Vergnet, F. Campabadal, C. Fleta, L. Fonseca, M. Lozano, C. Martínez, M. Ullán
    Electrical characteristics of high-energy proton irradiated ultra-thin gate oxides. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1501-1504 [Journal]
  50. F. Monsieur, E. Vincent, D. Roy, S. Bruyère, G. Pananakakis, G. Ghibaudo
    Gate oxide Reliability assessment optimization. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1505-1508 [Journal]
  51. P. Caprara, A. Barcella, M. Beltramello, C. Brambilla, S. Cereda, C. Caimi, V. Contin, V. Daniele, M. Fontana, P. Lucarno
    Analyses on NVM Circuitry Delay Induced by Source & Drain BF2 Implant. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1509-1511 [Journal]
  52. X. Blasco, M. Nafría, X. Aymerich
    Conduction and Breakdown Behaviour of Atomic Force Microscopy Grown SiO2 Gate Oxide on MOS Structures. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1513-1516 [Journal]
  53. J. Augereau, Y. Ousten, L. Béchou, Y. Danto
    Acoustic analysis of an assembly: Structural identification by signal processing (wavelets). [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1517-1522 [Journal]
  54. C. Passagrilli, L. Gobbato, R. Tiziani
    Reliability of Au/Al bonding in plastic packages for high temperature (200degreeC) and high current applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1523-1528 [Journal]
  55. P. Guilbault, E. Woirgard, C. Zardini, D. Lambert
    Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1529-1533 [Journal]
  56. Mohandass Sivakumar, Vaidyanathan Kripesh, Chong Ser Choong, Chai Tai Chong, Loon Aik Lim
    Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1535-1540 [Journal]
  57. Giulio Di Giacomo, Stefano Oggioni
    Reliability of Flip Chip Applications with Ceramic and Organic Chip Carriers. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1541-1546 [Journal]
  58. A. Seppälä, T. Allinniemi, Eero Ristolainen
    Failure mechanisms of adhesive flip chip joints. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1547-1550 [Journal]
  59. G. Duchamp, Y. Ousten, Y. Danto
    Evaluation of a micropackaging analysis technique by highfrequency microwaves. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1551-1554 [Journal]
  60. Alexandrine Guédon, Eric Woirgard, Christian Zardini
    Evaluation of lead-free soldering for automotive applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1555-1558 [Journal]
  61. L. Frisk, J. Järvinen, R. Ristolainen
    Chip on flex attachment with thermoplastic ACF for RFID applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1559-1562 [Journal]
  62. Cezary Sydlo, M. Saglam, Bastian Mottet, M. Rodríguez-Gironés, Hans L. Hartnagel
    Reliability investigations on HBV using pulsed electrical stress. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1563-1568 [Journal]
  63. M. Dammann, F. Benkhelifa, M. Meng, W. Jantz
    Reliability of Metamorphic HEMTs for Power Applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1569-1573 [Journal]
  64. N. Labat, N. Malbert, B. Lambert, A. Touboul, F. Garat, B. Proust
    Degradation mechanisms induced by thermal and bias stresses in InP HEMTs. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1575-1580 [Journal]
  65. Felix Beaudoin, D. Carisetti, Romain Desplats, Philippe Perdu, D. Lewis, J. C. Clement
    Backside Defect Localizations and Revelations Techniques on Gallium Arsenide (GaAs) Devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1581-1585 [Journal]
  66. P. Cova, Roberto Menozzi, M. Dammann, T. Feltgen, W. Jantz
    High-field step-stress and long term stability of PHEMTs with different gate and recess lengths. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1587-1592 [Journal]
  67. V. Ichizli, M. Rodríguez-Gironés, L. Marchand, C. Garden, O. Cojocari, Bastian Mottet, Hans L. Hartnagel
    Process Control and Failure Analysis Implementation for THz Schottky-based components. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1593-1596 [Journal]
  68. N. Seliger, E. Wolfgang, G. Lefranc, H. Berg, T. Licht
    Reliable power electronics for automotive applications. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1597-1604 [Journal]
  69. Alessandro Castellazzi, R. Kraus, N. Seliger, Doris Schmitt-Landsiedel
    Reliability analysis of power MOSFET's with the help of compact models and circuit simulation. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1605-1610 [Journal]
  70. R. Tiziani, G. Passoni, G. Santospirito
    Adhesive die attach for power application: Performance and reliability in plastic package. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1611-1616 [Journal]
  71. Sebastiano Russo, Romeo Letor, Orazio Viscuso, Lucia Torrisi, Gianluigi Vitali
    Fast thermal fatigue on top metal layer of power devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1617-1622 [Journal]
  72. Sudha Gopalan, Benno H. Krabbenborg, Jan-Hein Egbers, Bart van Velzen, Rene Zingg
    Reliability of power transistors against application driven temperature swings. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1623-1628 [Journal]
  73. F. Velardi, F. Iannuzzo, G. Busatto, J. Wyss, A. Kaminksy
    The Reliability of New Generation Power MOSFETs in Radiation Environment. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1629-1634 [Journal]
  74. G. Busatto, B. Cascone, L. Fratelli, M. Balsamo, F. Iannuzzo, F. Velardi
    Non-destructive high temperature characterisation of high-voltage IGBTs. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1635-1640 [Journal]
  75. G. Lefranc, T. Licht, G. Mitic
    Properties of solders and their fatigue in power modules. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1641-1646 [Journal]
  76. Masanori Usui, Takahide Sugiyama, Masayasu Ishiko, Jun Morimoto, Hirokazu Saitoh, Masaki Ajioka
    Characterization of Trench MOS Gate Structures Utilizing Photon Emission Microscopy. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1647-1652 [Journal]
  77. Mauro Ciappa, Flavio Carbognani, P. Cova, Wolfgang Fichtner
    A Novel Thermomechanics -Based Lifetime Prediction Model for Cycle Fatigue Failure Mechanisms in Power Semiconductors. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1653-1658 [Journal]
  78. G. Curro, R. Greco, A. Scandurra
    Growth process and chemical characterization of an ultrathin phosphate film grafted onto Al-alloy metallization surfaces relevant to microelectronic devices reliability. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1659-1662 [Journal]
  79. S. Moreau, S. Forster, T. Lequeu, R. Jérisian
    Influence of the turn-on mechanism on TRIACs' reliability: di/dt thermal fatigue study in Q1 compared to Q2. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1663-1666 [Journal]
  80. Chun-Cheng Tsao, Bill Thompson, Ted Lundquist
    Imaging and Material Analysis from Sputter-Induced Light Emission Using Coaxial Ion-Photon Column. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1667-1672 [Journal]
  81. Dionyz Pogany, J. Kuzmik, J. Darmo, Martin Litzenberger, Scrgey Bychikhin, K. Unterrainer, Z. Mozolova, S. Hascik, Tibor Lalinsky, E. Gornik
    Electrical field mapping in InGaP HEMTs and GaAs terahertz emitters using backside infrared OBIC technique. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1673-1677 [Journal]
  82. Katsuyoshi Miura, Koji Nakamae, Hiromu Fujioka
    CAD navigation system, for backside waveform probing of CMOS devices. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1679-1684 [Journal]
  83. A.-D. Müller, F. Müller, J. Middeke, J. Mehner, J. Wibbeler, Th. Gessner, M. Hietschold
    Double-cantilever device for Atomic Force Microscopy in dynamic noncontact-mode. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1685-1688 [Journal]
  84. Franco Stellari, Peilin Song, James C. Tsang, Moyra K. McManus, Mark B. Ketchen
    Optical diagnosis of excess IDDQ in low power CMOS circuits. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1689-1694 [Journal]
  85. M. Neinhüs, R. Weber, Ulf Behnke, W. Merlin, E. Kubalek, R. A. Breil, M. Detje, A. Feltz
    Contactless current and voltage measurements in integrated circuits by using a needle sensor. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1695-1700 [Journal]
  86. Maria Stangoni, Mauro Ciappa, Marco Buzzo, M. Leicht, Wolfgang Fichtner
    Simulation and Experimental Validation of Scanning Capacitance Microscopy Measurements across Low-doped Epitaxial PN-Junction. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1701-1706 [Journal]
  87. Jon C. Lee, C. H. Chen, David Su, J. H. Chuang
    Investigation of Sensitivity Improvement on Passive Voltage Contrast for Defect Isolation. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1707-1710 [Journal]
  88. T. H. Lee, X. Guo, G. D. Shen, Y. Ji, G. H. Wang, J. Y. Du, X. Z. Wang, G. Gao, A. Altes, L. J. Balk
    Investigation of Tunnel-Regenerated Multi-Active-Region Light-Emitting Diodes (TRMAR LED) by Scanning Thermal Microscopy (STHM). [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1711-1714 [Journal]
  89. C. Caprile, I. De Munari, M. Improntac, Simona Podda, A. Scorzoni, Massimo Vanzi
    A specimen-current branching approach for FA of long Electromigration test lines. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1715-1718 [Journal]
  90. R. F. Szeloch, T. P. Gotszalk, P. Janus
    Scanning Thermal Microscopy in Microsystem Reliability Analysis. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1719-1722 [Journal]
  91. C. Giret, D. Bru, D. Faure, C. Ali, M. Razani, D. Gobled
    Electrical characteristics measurement of transistors by 4 tips-0.2 micron probing technique in Semiconductor Failure Analysis. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1723-1727 [Journal]
  92. Felix Beaudoin, G. Haller, Philippe Perdu, Romain Desplats, T. Beauchêne, D. Lewis
    Reliability Defect Monitoring with Thermal Laser Stimulation: Biased Versus Unbiased. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1729-1734 [Journal]
  93. Janet E. Semmens, Lawrence W. Kessler
    Application of Acoustic Frequency Domain Imaging for the Evaluation of Advanced Micro Electronic Packages. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1735-1740 [Journal]
  94. O. Crépel, Felix Beaudoin, L. Dantas de Morais, G. Haller, C. Goupil, Philippe Perdu, Romain Desplats, D. Lewis
    Backside Hot Spot Detection Using Liquid Crystal Microscopy. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1741-1746 [Journal]
  95. N. Bicaïs-Lépinay, F. André, R. Pantel, S. Jullian, A. Margain, L. F. Tz. Kwakman
    Lift-out techniques coupled with advanced TEM characterization methods for electrical failure analysis. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1747-1752 [Journal]
  96. Joachim C. Reiner, Philippe Gasser, Urs Sennhauser
    Novel FIB-based sample preparation technique for TEM analysis of ultra-thin gate oxide breakdown. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1753-1757 [Journal]
  97. C. Hartmann, R. Weber, W. Mertin, E. Kubalek, A.-D. Müller, M. Hietschold
    Simultaneous IC-internal voltage and current measurements via a multi lever Scanning Force Microscope. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1759-1762 [Journal]
  98. O. Crépel, C. Goupil, B. Domengès, Ph. Descamps, Philippe Perdu, A. Doukkali
    Magnetic field measurements for Non Destructive Failure Analysis. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1763-1766 [Journal]
  99. D. Faure, C. A. Waggoner
    A New sub-micro probing technique for failure analysis in integrated circuits. [Citation Graph (0, 0)][DBLP]
    Microelectronics Reliability, 2002, v:42, n:9-11, pp:1767-1770 [Journal]
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